international micro industries (imi) offers state of the art wafer bumping and wafer level packaging wlp contract services via high aspect ratio, high precision electroplating and photolithography technology. imi offers complete solutions; wafers from received from the fabricator, bumped by imi, then sent directly to our clients in the advanced chip packaging, medical, automotive, sensor, rfid and mems industries world-wide.
Nøkkelord for å søke:
wafer bumping, wafer bumping contract services, wafer level processing, wafer level packaging contract services, wlp, wafer electroplating, high aspect ratio electroplating, electroplating, ubm, thick photoresist, gold bump, gold bumping, au bumping, solder bumps, solder bumping, tin lead bumps, pillar bumps, copper pillar bumps, copper electroplating, indium bumps, indium bumping, gold/tin bumps, au/sn bumps, au/sn bumping, known good packaging, known good die, advanced chip packaging, tape automated bonding, tab, flipchip, flip chip packaging, bare die packaging, fine pitch bumps, plated vias, plated bumps, bump, bumps, plating, imi, international micro industries, inc., cherry hill, new jersey, nj
Firma Adresse :
1951 Old Cuthbert Road - Building 404,HADDONFIELD,NJ,USA
ZIP Code: Postnummer :
8033
Telefonnummer :
8566160051 (+1-856-616-0051)
Faksnummer :
8566160226 (+1-856-616-0226)
Nettside :
imi-corp. com
e-post :
USA SIC kode ( Standard for næringsgruppering Code):
kopiere og lime inn denne google map til din nettside eller blogg!
Trykk på knappen kopiere og lime inn i din blogg eller nettside.
(Du kan bytte til HTML -modus når du legger inn din blogg. Examples: WordPress Example, Blogger Example)
Kontakt denne potensielle forhandler , kjøper, selger , leverandør , produsent , eksportør , importør
(Input kjøp , selg , sitere for produkter eller tjenester)