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- Copper Wire Bonding Concerns and Best Practices
reported the wire sweep performance of Cu to be dependent on the fabrication processes and heat treatments as well as the wire location during the transfer molding process Cu can help to achieve longer lower loop profiles, and it provides better looping control, including less wire sagging as compared with Au wire bonding 33,34 Cu wire
- Wire Bonding Loop Profiles; Low-loop Wirebonding; etc.
Even if the wires are not exposed, high loops can also produce long and sagging wires that are prone to being swept by the molding compound in the direction of its flow during the encapsulation process, a phenomenon known as 'wire sweeping ' Wire sweeping can result in shorting between wires
- The Ultimate Guide to Wire Bonding Wires - Intech
Wire Sweep: Wire sweep refers to the lateral movement of the wire during the bonding process It can occur due to factors such as improper tool alignment, excessive bonding force, or inadequate wire support
- Detect different wire bond deformation defects with VTEP - Keysight
Adjacent wire coupling of near short sweeping wires However, capacitive coupling can happen in all directions When the sweeping wire gets close to the adjacent wire, the stimulus can couple over to the adjacent wire, adding to the overall surface area to increase the capacitive coupling strength
- Stacked Die Multi-tier Applications | Semiconductor Digest
But with multi-layer stacking comes the challenge of more complex loop profiles Wire loop length is elongated, which requires stronger loop process control to ensure robust loop formations void of looping failures
- THREE-DIMENSIONAL CAE OF WIRE-SWEEP IN MICROCHIP ENCAPSULATION - MOLDEX-3D
Wire Sweep is a common molding problem encountered in microchip encapsulation The resin melt flow will exert drag force on wires and hence causes deformation of wires In this paper, an integrated CAE of wire sweep is proposed to help engineer to evaluate and optimize the encapsulation process
- Evolutions of bonding wires used in semiconductor electronics . . .
We focus on the influence of a variety of factors that have been reported recently, including re-liability performance, wear out reliability performance that determine the selection of bonding wires to reach for de-veloping high reliability of bonded devices
- Wire Sweep Issue in a Newly Developed Quad Flat No-Lead (QFN . . .
Lower wire sweep possesses higher sweep stiffness and thereby higher rate of semiconductor package In this paper, three looping parameters have been analyzed, i e kink height, reverse motion and loop factor, for which they have considered to perform nine combinations of looping formations
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